Données au 25 oct. 2026, 20:50 UTC · politique pm-quality-4
Tendances
Marchés Associés
Questions liées pour le contexte, et non une comparaison de contrats équivalents.
In the US, will there be binding legislation or an executive order explicitly addressing AI risks by the end of 2026?
Will at least one U.S. state enact a binding statewide moratorium on new hyperscale data centers before 2027?
By the end of 2026, will global crude steelmaking capacity be at least 2,600 million tonnes per year?
China's primary aluminium capacity exceeds 30% benchmark energy efficiency by 2027?
Will Georgia regulators approve 4 more gigawatts of generating capacity?
Will any China-domestic AI chip reach ≥80% of NVIDIA H100 perf on a public benchmark before 2026-12-31?
Règles
Resolves YES if, on or before 2026-12-31, TSMC's CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging capacity is no longer the binding constraint on advanced AI accelerator production, per publicly accessible evidence.
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